33813 Datasheet, PDF (9/54 Pages) Freescale Semiconductor, Inc – One Cylinder Small Engine Control IC

Table 3. MAXIMUM RATINGS
All voltages are with respect to ground, unless mentioned otherwise. Exceeding these ratings may cause malfunction or
permanent device damage.
Parameter
Symbol
Min.
Max.
Unit
ELECTRICAL RATINGS (CONTINUED)
VRS Sensor Input Current Range
• Maximum current into VRSN pin or VRSP pin and IC Ground
I_{VRS_IN}
-15
+15
mA
THERMAL RATINGS
Operating Temperature (Automotive grade version)
• Ambient
• Junction
• Case
Storage Temperature
Power Dissipation (T_A  25 C)
Peak Package Reflow Temperature During Reflow⁽⁴⁾, ⁽⁵⁾
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
T_A
-40
T_J
-40
T_C
-40
T_STG
-55
P_D
–
T_PPRT
–
C
125
150
125
150
C
3.0
W
Note 5
°C
Thermal Resistance
• Junction-to-Ambient (LQFP-48-EP Package) (Single Layer Board)
• Junction-to-Case (LQFP-48-EP Package)
R_JA
29
R_JC
2.4
C/W
29
2.4
Notes
2. ESD data available upon request. (Items in red are not associated with any parameter)
3. ESD1 testing is performed in accordance with the Human Body Model (AEC-Q100-002) and the Machine Model (AEC-Q100-003).
4. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33813
9