MSC8254_11 Datasheet, PDF (65/68 Pages) Freescale Semiconductor, Inc – Quad-Core Digital Signal Processor

Ordering Information
3.6 Guide to Selecting Connections for Remote Power Supply
Sensing
To assure consistency of input power levels, some applications use a practice of connecting the remote sense signal input of an
on-board power supply to one of power supply pins of the IC device. The advantage of using this connection is the ability to
compensate for the slow components of the IR drop caused by resistive supply current path from on-board power supply to the
pins layer on the package. However, because of specific device requirements, not every ball connection can be selected as the
remote sense pin. Some of these pins must be connected to the appropriate power supply or ground to ensure correct device
functionality. Some connections supply critical power to a specific high usage area of the IC die; using such a connection as a
non-supply pin could impact necessary supply current during high current events. The following balls can be used as the board
supply remote sense output without degrading the power and ground supply quality:
• VDD: W10, T19
• VSS: J18, Y10
• M3VDD: None
Do not use any other connections for remote sensing. Use of any other connections for this purpose can result in application and
device failure.
4 Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Package Type
MSC8254 Flip Chip Plastic Ball Grid Array (FC-PBGA)
Spheres
Lead-free
Core
Voltage
Operating
Temperature
Core
Frequency
(MHz)
Order Number
1.0 V
0° C to 105°C
–40° C to 105°C
0° C to 105°C
–40° C to 105°C
1000
1000
800
800
MSC8254SVT1000B
MSC8254TVT1000B
MSC8254SVT800B
MSC8254TVT800B
MSC8254 Quad-Core Digital Signal Processor Data Sheet, Rev. 6
Freescale Semiconductor
65