BC3770 Datasheet, PDF (6/45 Pages) Freescale Semiconductor, Inc – 2.0 A Switch-Mode Charger

4 Electrical Characteristics
4.1 Maximum Ratings
Stress(es) beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the following operational sections
of the specifications is not implied. Exposure to absolute maximum rating condition(s) for extended periods may affect device reliability.
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted.
Symbol
Rating
Min.
Max.
Unit
Notes
ELECTRICAL RATINGS
VBUS, PMID to GND
LX to GN
BOOT to LX
-0.3
20
-0.3
20
- 0.3
5.5
V
(1)
V
(1)
V
(1)
BOOT to GND
PGND, BATSNSN to GND
- 0.3
25.5
- 0.3
0.3
V
V
(1)
VL to GND
- 0.3
5.5
V
VSYS, CHGOUT, BATREG to GND
PGND to GND
All Other Pins to GND
- 0.3
Continuous
6.0
V
- 0.3
0.3
V
(1)
- 0.3
5.5
(1)
V_ESD1
V_ESD3
ESD Voltage
• Human Body Model (HBM)
• Machine Model
THERMAL RATINGS
—
2000
V
(2)
—
200
(3)
Continuous Power Dissipation
• T_A  25 °C
• T_A  70 °C
• T_A  85 °C
—
—
2.08
1.14
W
—
0.832
T_A
T_J
T_STG
T_SOLDER
T_JA
Operating Temperature
• Ambient
Maximum Temperature
• Junction
Storage Ambient Temperature
Lead Soldering Temperature (within 10 s)
Thermal Resistance Junction to Ambient
- 40
85
C
—
150
C
-65
150
C
—
300
°C
—
48
°C/W
(4), (5)
Notes
1. GND: all of the PGND and GND should be within the limit.
2. Human Body Model (HBM) per JESD22-A114 for all pins
3. Highly depends on the PCB heat dissipation. Tested with the Thermal Characteristics test condition below.
4. T_A = 70 °C
5. Measured in still air, free convection condition (conforms to EIA/JESD51-2) on high effective thermal conductivity JESD51-7 test board.
Analog Integrated Circuit Device Data
Freescale Semiconductor
BC3770
6