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MC9S12P64CFT Datasheet, PDF (506/566 Pages) Freescale Semiconductor, Inc – Microcontrollers | |||
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Electrical Characteristics
PIO is the sum of all output currents on I/O ports associated with VDDX, whereby
RDSON = V--I--O-O----L-L--;for outputs driven low
RDSON = V-----D----D-----3I--O-5----Hâ-----V----O-----H---;for outputs driven high
PINT = IDDR â
VDDR + IDDA â
VDDA
Table A-5. Thermal Package Characteristics(1)
Num C
Rating
Symbol
Min
Typ
Max
Unit
QFN 48
1 D Thermal resistance QFN 48, single sided PCB(2)
θJA
â
â
82
°C/W
2 D Thermal resistance QFN 48, double sided PCB
with 2 internal planes(3)
θJA
â
â
28
°C/W
3 D Junction to Board QFN 48
4 D Junction to Case QFN 484
5 D Junction to Case (Bottom) QFN 485
θJB
â
â
11
°C/W
θJC
â
â
1.4
°C/W
ΨJT
â
â
4
°C/W
QFP 80
6 D Thermal resistance QFP 80, single sided PCB2
θJA
â
â
56
°C/W
7 D Thermal resistance QFP 80, double sided PCB
with 2 internal planes3
θJA
â
â
43
°C/W
8 D Junction to Board QFP 80
9 D Junction to Case QFP 80(4)
10 D Junction to Package Top QFP 80(5)
θJB
â
â
28
°C/W
θJC
â
â
19
°C/W
ΨJT
â
â
5
°C/W
LQFP 64
11 D Thermal resistance LQFP 64, single sided PCB2
θJA
â
â
70
°C/W
12 D Thermal resistance LQFP 64, double sided PCB
with 2 internal planes3
θJA
â
â
52
°C/W
13 D Junction to Board LQFP 64
θJB
â
â
35
°C/W
14 D Junction to Case LQFP 64(6)
θJC
â
â
17
°C/W
15 D Junction to Package Top LQFP 64(7)
ΨJT
â
â
1. The values for thermal resistance are achieved by package simulations
3
°C/W
2. Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC speciï¬cation JESD51-2 in a
horizontal conï¬guration in natural convection.
3. Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC speciï¬cation JESD51-7 in a
horizontal conï¬guration in natural convection.
S12P-Family Reference Manual, Rev. 1.13
506
Freescale Semiconductor
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