33894 Datasheet, PDF (5/28 Pages) Freescale Semiconductor, Inc – Quad High-Side Switch

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Operating Voltage Range
Steady-State
V_PWR(SS)
V
-16 to 41
V_DD Supply Voltage
Input/Output Voltage ⁽¹⁾
V_DD
0 to 5.5
V
V_IN[0:3], RST,
- 0.3 to 7.0
V
FSI, CSNS, SI,
SCLK, CS, FS
SO Output Voltage ⁽¹⁾
V_SO
-0.3 to V_DD+0.3
V
WAKE Input Clamp Current
CSNS Input Clamp Current
Output Current ⁽²⁾
I_CL(WAKE)
2.5
mA
I_CL(CSNS)
10
mA
I_HS[0:3]
11
A
Output Clamp Energy ⁽³⁾
E_{CL [0:3]}
TBD
J
ESD Voltage ⁽⁴⁾
Human Body Model
Machine Model
V
V_ESD1
V_ESD2
± 2000
± 200
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Storage Temperature
Thermal Resistance ⁽⁵⁾
Junction to Case
Junction to Ambient
T_A
T_J
T_STG
R_θJC
R_θJA
- 40 to 125
- 40 to 150
- 55 to 150
<1.0
TBD
°C
°C
°C/ W
Peak Pin Reflow Temperature During Solder Mounting ⁽⁶⁾
T_SOLDER
240
°C
Notes
1. Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent damage to
the device.
2. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 16 mH, R_L = 0 Ω, V_PWR = 12 V, T_J = 150°C).
4. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (C_ZAP = 200 pF, R_ZAP = 0 Ω) and in accordance with the system module specification with a
capacitor > 0.01 µF connected from high-side outputs to GND.
5. Device mounted on a 2s2p test board per JEDEC JESD51-2.
6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33894
5