33486A Datasheet, PDF (4/30 Pages) Freescale Semiconductor, Inc – Dual High-Side Switch for H-Bridge Applications

MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Power Supply Voltage: Continuous / Pulse
V_BAT
- 0.3 to 40
V
OUT1, OUT2 to V_BAT Voltage: Continuous / Pulse
V_OUT
- 0.3 to 40
V
IN1, IN2, WAKE, ST Input DC Voltage: Continuous / Pulse
V_IN
- 0.3 to 7.0
V
IN1, IN2, WAKE Input Current
Output DC Output Current, 1 Channel ON, T_A = 85°C ⁽¹⁾
Output Current: Pulse ⁽²⁾
I_IN
± 5.0
mA
I_OUTDC
10
A
I_OUTP
Self-Limited
A
Operating Junction Temperature
T_J
- 40 to 150
°C
Operating Ambient Temperature
T_A
- 40 to 125
°C
Storage Temperature
T_STG
- 65 to 150
°C
Thermal Resistance
Junction to Case
Junction to Ambient ⁽¹⁾
R_θJC
R_θJA
°C/W
2.0
25
Power Dissipation at T_CASE 140°C ⁽³⁾
P_D
5.0
W
ESD All Terminals
Human Body Model ⁽⁴⁾
Machine Mode ⁽⁵⁾
V
V_ESD1
±2000
V_ESD2
±200
Terminal Soldering Temperature ⁽⁶⁾
T_SOLDER
240
°C
Notes
1. Device mounted on dual-side printed circuit board with 70 µm copper thickness and 10 cm² copper heatsink (2.5 cm² on top side and
7.5 cm² on down side).
2. See high-side output current shutdown, I_LIM.
3. Assuming a 150°C maximum junction temperature.
4. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP= 100 pF, R_ZAP= 1500 Ω).
5. ESD2 testing is performed in accordance with the Machine Model (C_ZAP= 200 pF, R_ZAP= 0 Ω).
6. The maximum peak temperature during the soldering process should not exceed 235°C (+5.0°C/-0°C). The time within 5.0°C of actual
peak temperature should range from 10 s to 30 s max.
33486A
4
Analog Integrated Circuit Device Data
Freescale Semiconductor