33486A Datasheet, PDF (28/30 Pages) Freescale Semiconductor, Inc – Dual High-Side Switch for H-Bridge Applications

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 7. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
R_θJA
0
51
50
53
300
35
34
38
600
31
30
33
R_θJS
0
11
10
13
300
7.0
7.0
10
600
7.0
6.0
9.0
R_θJA is the thermal resistance between die junction and
ambient air.
R_θJS is the thermal resistance between die junction and
the reference location on the board surface near a center
lead of the package (see Figure 31).
33486A
28
Analog Integrated Circuit Device Data
Freescale Semiconductor