908E626 Datasheet, PDF (36/38 Pages) Freescale Semiconductor, Inc – Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4/OSC1
PTC3/OSC2
PTC2 / MCLK
PTB5/AD5
PTB4/AD4
PTB3/AD3
IRQ
RST
PTB1/AD1
PTD0 / TACH0 / BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Exposed
15
Pad
16
17
18
19
20
21
22
23
24
25
26
27
54
PTA0/KBD0
53
PTA1/KBD1
52
PTA2/KBD2
51
FLSVPP
50
PTA3/KBD3
49
PTA4/KBD4
48
VREFH
47
VDDA
46
EVDD
45
EVSS
44
VSSA
43
VREFL
42
PTE1/RXD
41
RXD
40
VSS
39
NC
38
VDD
37
NC
36
NC
35
NC
34
HVDD
33
NC
32
HB4
31
VSUP3
30
GND2
29
HB3
28
NC
908E626 Terminal Connections
54-Terminal SOICW-EP
0.65 mm Pitch
17.9 mm x 7.5 mm Body
10.3 mm x 5.1 mm Exposed Pad
Figure 20. Thermal Test Board
A
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 10. Thermal Resistance Performance
Thermal
Resistance
Area A
(mm²)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
R_θJAmn
0
53
48
53
300
39
34
38
600
35
30
34
R_θJSmn
0
21
16
20
300
15
11
15
600
14
9.0
13
R_θJA is the thermal resistance between die junction and
ambient air.
R_θJSmn is the thermal resistance between die junction and
the reference location on the board surface near a center
lead of the package.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
908E626
36
Analog Integrated Circuit Device Data
Freescale Semiconductor