908E626 Datasheet, PDF (5/38 Pages) Freescale Semiconductor, Inc – Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication

MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
V
Analog Chip Supply Voltage under Normal Operation (Steady-
V_SUP(SS)
- 0.3 to 28
State)
V_SUP(PK)
- 0.3 to 40
Analog Chip Supply Voltage under Transient Conditions ⁽¹⁾
V_DD
- 0.3 to 6.0
Microcontroller Chip Supply Voltage
Input Terminal Voltage
Analog Chip
Microcontroller Chip
V
V_{IN (ANALOG)}
V_{IN (MCU)}
- 0.3 to 5.5
V_SS - 0.3 to V_DD + 0.3
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0 : PTA6, PTC0 : PTC1
Terminals PTA0 : PTA6, PTC0 : PTC1
I_PIN(1)
I_PIN(2)
mA
±15
± 25
Maximum Microcontroller V_SS Output Current
I_MVSS
100
mA
Maximum Microcontroller V_DD Input Current
I_MVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions ⁽¹⁾
ESD Voltage
Human Body Model ⁽²⁾
Machine Model ⁽³⁾
Charge Device Model ⁽⁴⁾
V
V_BUS(SS)
V_BUS(DYNAMIC)
-18 to 28
40
V_ESD1
V_ESD2
V_ESD3
V
± 3000
± 150
± 500
THERMAL RATINGS
Storage Temperature
Operating Case Temperature ⁽⁵⁾
T_STG
T_C
- 40 to 150
°C
- 40 to 115
°C
Operating Junction Temperature⁽⁶⁾
T_J
- 40 to 135
°C
Peak Package Reflow Temperature During Solder Mounting ⁽⁷⁾
T_SOLDER
245
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD1 testing is performed in accordance with the Human Body Model (C_ZAP = 100 pF, R_ZAP = 1500 Ω).
3. ESD2 testing is performed in accordance with the Machine Model (C_ZAP =200 pF, R_ZAP = 0 Ω).
4. ESD3 testing is performed in accordance with Charge Device Model, robotic (C_ZAP =4.0 pF).
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
7. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E626
5