MC9S08AC60 Datasheet, PDF (329/348 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering numbers for MC9S08AC60 Series devices. See below for an example of the
device numbering system.
Table B-1. Device Numbering System
Device Number¹
Memory
Flash
RAM
Available Packages²
Type
MC9S08AC60
63,280
64 LQFP, 64 QFP
48 QFN, 44 LQFP, 32 LQFP
MC9S08AC48
49,152
2048
64 LQFP, 64 QFP
48 QFN, 44 LQFP, 32 LQFP
MC9S08AC32
32,768
64 LQFP, 64 QFP
48 QFN, 44 LQFP, 32 LQFP
1 _{See Table 1-1 for a complete description of modules included on each device.}
2 _{See Table B-2 for package information.}
B.2 Orderable Part Numbering System
Status
(MC = Fully Qualified)
Memory
(9 = FLASH-based)
Core
Family
MC 9 S08 AC 60 C XX E
Pb free indicator
Package designator (See Table B-2)
Temperature range
(C = –40°C to 85°C)
(M = –40°C to 125°C)
Approximate memory size (in KB)
B.3 Mechanical Drawings
This following pages contain mechanical specifications for MC9S08AC60 Series package options. See
Table B-2 for the document numbers that correspond to each package type.
Table B-2. Package Information
Pin Count
64
64
48
Type
LQFP
QFP
QFN
Designator
PU
FU
FD
Document No.
98ASS23234W
98ASB42844B
98ARH99048A
MC9S08AC60 Series Data Sheet, Rev. 2
Freescale Semiconductor
329