MC9S08AC60 Datasheet, PDF (17/348 Pages) Freescale Semiconductor, Inc – Microcontrollers

Section Number
Title
Page
15.6.1 Counter ............................................................................................................................270
15.6.2 Channel Mode Selection .................................................................................................272
15.7 Reset Overview .............................................................................................................................275
15.7.1 General ............................................................................................................................275
15.7.2 Description of Reset Operation .......................................................................................275
15.8 Interrupts .......................................................................................................................................275
15.8.1 General ............................................................................................................................275
15.8.2 Description of Interrupt Operation ..................................................................................276
15.9 The Differences from TPM v2 to TPM v3 ....................................................................................277
Chapter 16
Development Support
16.1 Introduction ...................................................................................................................................281
16.1.1 Features ...........................................................................................................................282
16.2 Background Debug Controller (BDC) ..........................................................................................282
16.2.1 BKGD Pin Description ...................................................................................................283
16.2.2 Communication Details ..................................................................................................284
16.2.3 BDC Commands .............................................................................................................288
16.2.4 BDC Hardware Breakpoint .............................................................................................290
16.3 On-Chip Debug System (DBG) ....................................................................................................291
16.3.1 Comparators A and B ......................................................................................................291
16.3.2 Bus Capture Information and FIFO Operation ...............................................................291
16.3.3 Change-of-Flow Information ..........................................................................................292
16.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................292
16.3.5 Trigger Modes .................................................................................................................293
16.3.6 Hardware Breakpoints ....................................................................................................295
16.4 Register Definition ........................................................................................................................295
16.4.1 BDC Registers and Control Bits .....................................................................................295
16.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................297
16.4.3 DBG Registers and Control Bits .....................................................................................298
Appendix A
Electrical Characteristics and Timing Specifications
A.1 Introduction ....................................................................................................................................303
A.2 Parameter Classification.................................................................................................................303
A.3 Absolute Maximum Ratings...........................................................................................................304
A.4 Thermal Characteristics..................................................................................................................305
A.5 ESD Protection and Latch-Up Immunity .......................................................................................306
A.6 DC Characteristics..........................................................................................................................308
A.7 Supply Current Characteristics.......................................................................................................311
A.8 ADC Characteristics.......................................................................................................................314
A.9 Internal Clock Generation Module Characteristics ........................................................................317
MC9S08AC60 Series Data Sheet, Rev. 2
Freescale Semiconductor
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