K20P120M100SF2 Datasheet, PDF (21/66 Pages) Freescale Semiconductor, Inc – K20 Data Sheet

5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol Description
T_J
Die junction temperature
T_A
Ambient temperature
T_J
Die junction temperature
T_A
Ambient temperature
MK20DN512ZCAB10R
MK20DN512ZAB10R
Min.
–40
–40
0
0
Max.
95
85
80
70
General
Unit
°C
°C
°C
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
120 WLCSP
Thermal
83
resistance, junction
to ambient (natural
convection)
Thermal
37
resistance, junction
to ambient (natural
convection)
Thermal
11
resistance, junction
to board
Thermal
2.4
resistance, junction
to case
Thermal
3
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1,2, 3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. Board meets JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
4.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
5.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
K20 Data Sheet Data Sheet, Rev. 6.1, 08/2012.
Freescale Semiconductor, Inc.
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