K10P81M72SF1 Datasheet, PDF (21/73 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

5.4.1 Thermal operating requirements
Table 10. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
–40
–40
Max.
125
105
General
Unit
°C
°C
5.4.2 Thermal attributes
Board type
Single-layer
(1s)
Symbol
R_θJA
Four-layer
(2s2p)
R_θJA
Single-layer
(1s)
R_θJMA
Four-layer
(2s2p)
R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description 81 MAPBGA
Thermal
74
resistance,
junction to
ambient (natural
convection)
Thermal
42
resistance,
junction to
ambient (natural
convection)
Thermal
62
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
38
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
23
resistance,
junction to
board
Thermal
19
resistance,
junction to case
Thermal
4
characterization
parameter,
junction to
package top
outside center
(natural
convection)
80 LQFP
51
36
41
30
20
10
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1,3
1,3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
Freescale Semiconductor, Inc.
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