K10P81M72SF1 Datasheet, PDF (2/73 Pages) Freescale Semiconductor, Inc – K10 Sub-Family

Table of Contents
1 Ordering parts...........................................................................3
5.4.2 Thermal attributes.................................................21
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................22
2 Part identification......................................................................3
6.1 Core modules....................................................................22
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................22
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................23
2.3 Fields.................................................................................3
6.2 System modules................................................................25
2.4 Example............................................................................4
6.3 Clock modules...................................................................25
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................25
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................28
3.2 Definition: Operating behavior...........................................5
6.3.3 32kHz Oscillator Electrical Characteristics............30
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................31
3.4 Definition: Rating...............................................................6
6.4.1 Flash electrical specifications................................31
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort Switching Specifications............................35
3.6 Relationship between ratings and operating
6.4.3 Flexbus Switching Specifications..........................36
requirements......................................................................6
6.5 Security and integrity modules..........................................39
3.7 Guidelines for ratings and operating requirements............7
6.6 Analog...............................................................................39
3.8 Definition: Typical value.....................................................7
6.6.1 ADC electrical specifications.................................39
3.9 Typical value conditions....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........48
4 Ratings......................................................................................9
6.6.3 12-bit DAC electrical characteristics.....................50
4.1 Thermal handling ratings...................................................9
6.6.4 Voltage reference electrical specifications............53
4.2 Moisture handling ratings..................................................9
6.7 Timers................................................................................54
4.3 ESD handling ratings.........................................................9
6.8 Communication interfaces.................................................55
4.4 Voltage and current operating ratings...............................9
6.8.1 CAN switching specifications................................55
5 General.....................................................................................10
6.8.2 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................10
range)....................................................................55
5.2 Nonswitching electrical specifications...............................10
6.8.3 DSPI switching specifications (full voltage range).56
5.2.1 Voltage and current operating requirements.........10
6.8.4 I2C switching specifications..................................58
5.2.2 LVD and POR operating requirements.................12
6.8.5 UART switching specifications..............................58
5.2.3 Voltage and current operating behaviors..............12
6.8.6 I2S/SAI Switching Specifications..........................58
5.2.4 Power mode transition operating behaviors..........13
6.9 Human-machine interfaces (HMI)......................................63
5.2.5 Power consumption operating behaviors..............14
6.9.1 TSI electrical specifications...................................63
5.2.6 Designing with radiated emissions in mind...........18
7 Dimensions...............................................................................64
5.2.7 Capacitance attributes..........................................18
7.1 Obtaining package dimensions.........................................64
5.3 Switching specifications.....................................................19
8 Pinout........................................................................................64
5.3.1 Device clock specifications...................................19
8.1 K10 Signal Multiplexing and Pin Assignments..................64
5.3.2 General switching specifications...........................19
8.2 K10 Pinouts.......................................................................69
5.4 Thermal specifications.......................................................20
9 Revision History........................................................................71
5.4.1 Thermal operating requirements...........................20
K10 Sub-Family Data Sheet, Rev. 2, 4/2012.
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Freescale Semiconductor, Inc.