K11P80M50SF4 Datasheet, PDF (20/54 Pages) Freescale Semiconductor, Inc – K11 Sub-Family Data Sheet

General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
Max.
Unit
–40
125
°C
–40
105
°C
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
Single-layer (1s) R_θJMA
Four-layer (2s2p) R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
80 LQFP
Thermal
50
resistance, junction
to ambient (natural
convection)
Thermal
35
resistance, junction
to ambient (natural
convection)
Thermal
39
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
29
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
19
resistance, junction
to board
Thermal
8
resistance, junction
to case
Thermal
2
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1, 3
1,3
1,3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
K11 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
20
Freescale Semiconductor, Inc.