MC68HC05RC8 Datasheet, PDF (112/122 Pages) Freescale Semiconductor, Inc – General Release Specification

Freescale Semiconductor, Inc.
Mechanical Specifications
12.3 28-Pin Plastic Dual In-Line Package (Case 710-02)
28
1
A
HG
F
15
B
14
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 36.45 37.21 1.435 1.465
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC
0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L
15.24 BSC
0.600 BSC
M
0° 15°
0°
15°
N 0.51 1.02 0.020 0.040
12.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04)
28
1
-T-
-A-
15
-B-
14X P
0.010 (0.25) ^M B ^M
14
28X D
0.010 (0.25) ^M T A S B S
M
R X 45°
26X G
C
-T-
SEATING
PLANE
K
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
0°
8°
0°
8°
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
General Release Specification
MC68HC05RC16 — Rev. 3.0
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com