RHFAC244D03V Datasheet, PDF (25/27 Pages) List of Unclassifed Manufacturers – DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990

APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-87552
Die physical dimensions.
Die size:
Die thickness:
2408 x 2250 µm
285 ±25 µm
Interface materials.
Top metallization:
Al Si Cu
0.85 µm
Backside metallization:
None
Glassivation.
Type:
Thickness:
P. Vapox + Nitride
0.5 µm – 0.7 µm
Substrate:
Silicon
Assembly related information.
Substrate potential:
Floating or tied to GND
Special assembly instructions: Bond pad #20 (VCC) first
FIGURE A-1. Die bonding pad locations and electrical functions – Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
K
5962-87552
SHEET
25