RHFAC14K01V Datasheet, PDF (21/24 Pages) List of Unclassifed Manufacturers – STANDARD MICROCIRCUIT DRAWING

APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-87624
Die physical dimensions.
Die size:
Die thickness:
76.4 x 62.1 mils
285 ±25 µm (11 ±1 mils)
Die bonding pad locations and electrical functions.
Pad size:
Pad numbers 1 to 6 and 8 to 13:
100 x 100 µm
Pad numbers 7 (GND) and 14 (V_CC): 100 x 280 µm
Optional manufacture’s
logo
NOTE: Pad numbers reflect terminal numbers when placed in case outline X (see figure 1).
FIGURE A-1
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-87624
SHEET
21