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NT5DS32M8AT Datasheet, PDF (18/27 Pages) List of Unclassifed Manufacturers – 256Mb DDR333/300 SDRAM
NT5DS64M4AT NT5DS64M4AW
NT5DS32M8AT NT5DS32M8AW
256Mb DDR333/300 SDRAM
DC Electrical Characteristics and Operating Conditions
(0°C ≤ TA ≤ 70°C; VDDQ = 2.5V ± 0.2V, VDD = + 2.5V ± 0.2V, see AC Characteristics)
Symbol
IOHW
IOLW
Parameter
Output Current: Half- Strength Driver
High current (VOUT= VDDQ -0.763V, min VREF, min VTT)
Low current (VOUT= 0.763V, max VREF, max VTT)
Min
− 9.0
9.0
Max
Units
Notes
mA
1
1. Inputs are not recognized as valid until VREF stabilizes.
2. VREF is expected to be equal to 0.5 VDDQ of the transmitting device, and to track variations in the DC level of the same. Peak-to-peak
noise on VREF may not exceed ± 2% of the DC value.
3. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and
must track variations in tHalf-he DC level of VREF.
4. VID is the magnitude of the difference between the input level on CK and the input level on CK.
5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire tempera-ture and
voltage range, for device drain to source voltages for 0.25 volts to 1.0 volts. For a given output, it represents the maximum difference
between pullup and pulldown drivers due to process variation.
Preliminary
10/01
18
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