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M12L128168A_09 Datasheet, PDF (4/45 Pages) Elite Semiconductor Memory Technology Inc. – 2M x 16 Bit x 4 Banks Synchronous DRAM | |||
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ESMT
M12L128168A
DC CHARACTERISTICS
Recommended operating condition unless otherwise notedï¼TA = 0 to 70 °C
Parameter
Symbol
Test Condition
Operating Current
(One Bank Active)
Precharge Standby Current
in power-down mode
Precharge Standby Current
in non power-down mode
Active Standby Current
in power-down mode
ICC1
ICC2P
ICC2PS
ICC2N
ICC2NS
ICC3P
ICC3PS
Burst Length = 1, tRC ⥠tRC(min), IOL = 0 mA
CKE ⤠VIL(max), tcc = tCK(MIN)
CKE & CLK ⤠VIL (max), tCC = â
CKE ⥠VIH(min), CS ⥠VIH(min), tCC = tCK(MIN)
Input signals are changed one time during 2tck
CKE ⥠VIH(min), CLK ⤠VIL(max), tcc = â
input signals are stable
CKE ⤠VIL(max), tCC = tCK(MIN)
CKE & CLK ⤠VIL(max), tCC = â
Active Standby Current
in non power-down mode
(One Bank Active)
Operating Current
(Burst Mode)
Refresh Current
Self Refresh Current
ICC3N
ICC3NS
ICC4
ICC5
ICC6
CKE ⥠VIH(min), CS ⥠VIH(min), tCC=15ns
Input signals are changed one time during 2clks
All other pins ⥠VDD-0.2V or ⤠0.2V
CKE ⥠VIH(min), CLK ⤠VIL(max), tCC = â
input signals are stable
IOL = 0 mA, Page Burst, 2 Banks activated
tRC ⥠tRC(min)
CKE ⤠0.2V
Note : 1. Measured with outputs open.
2. Input signals are changed one time during 2 CLKS.
Version
-5 -6 -7
Unit Note
170 160 140 mA 1,2
2
mA
2
45
mA
25
6
mA
6
mA
55
35
mA
280 210 180 mA 1,2
280 210 180 mA
2
mA
Elite Semiconductor Memory Technology Inc.
Publication Date: Mar. 2009
Revision: 2.3
4/45
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