EN25D16 Datasheet, PDF (19/37 Pages) Eon Silicon Solution Inc. – 16 Megabit Serial Flash Memory

EN25D16
Figure 13. Sector Erase Instruction Sequence Diagram
Block Erase (BE) (D8h/52h)
The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the in-
struction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven
Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 14. Chip Select (CS#) must be driven High after the
eighth bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is
not executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose
duration is tSE) is initiated. While the Block Erase cycle is in progress, the Status Register may be
read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1
during the self-timed Block Erase cycle, and is 0 when it is completed. At some unspecified time
before the cycle is completed, the Write Enable Latch (WEL) bit is reset.
A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP2, BP1,
BP0) bits (see Table 3) is not executed.
Figure 14 Block Erase Instruction Sequence Diagram
This Data Sheet may be revised by subsequent versions ₁₉ ©2004 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
Rev. B, Issue Date: 2008/06/23