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EN25D16 Datasheet, PDF (10/37 Pages) Eon Silicon Solution Inc. – 16 Megabit Serial Flash Memory
EN25D16
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first.
Serial Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#)
is driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant
bit first, on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by
both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence
has been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed
(Fast_Read), Read Status Register (RDSR) or Release from Deep Power-down, and Read Device
ID (RDI) instruction, the shifted-in instruction sequence is followed by a data-out sequence. Chip
Select (CS#) can be driven High after any bit of the data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write
Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (CS#) must be driven High exactly at a byte boundary, otherwise the
instruction is rejected, and is not executed. That is, Chip Select (CS#) must driven High when the
number of clock pulses after Chip Select (CS#) being driven Low is an exact multiple of eight. For
Page Program, if at any time the input byte is not a full byte, nothing will happen and WEL will not be
reset.
In the case of multi-byte commands of Page Program (PP), and Release from Deep Power
Down (RES ) minimum number of bytes specified has to be given, without which, the
command will be ignored.
In the case of Page Program, if the number of byte after the command is less than 4 (at least
1 data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must,
any less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or
Erase cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle
continues unaffected.
Table 4. Instruction Set
Instruction Name Byte 1
Code
Write Enable
06h
Write Disable / Exit
OTP mode
04h
Read Status
Register
05h
Write Status
Register
01h
Read Data
03h
Fast Read
0Bh
Byte 2
Byte 3
(S7-S0)(1)
S7-S0
A23-A16
A23-A16
A15-A8
A15-A8
Dual Output Fast
Read
Page Program
Sector Erase
Block Erase
Chip Erase
Deep Power-down
3Bh
A23-A16
02h
A23-A16
20h
A23-A16
D8h/ 52h A23-A16
C7h/ 60h
B9h
A15-A8
A15-A8
A15-A8
A15-A8
Byte 4 Byte 5
A7-A0
A7-A0
(D7-D0)
dummy
A7-A0 dummy
A7-A0
A7-A0
A7-A0
D7-D0
Byte 6
n-Bytes
continuous(2)
(Next byte)
(D7-D0)
DI =
(D6, D4, D2, D0)
DO =
(D7, D5, D3, D1)
Next byte
continuous
(Next Byte)
continuous
(one byte
per 4 clocks,
continuous)
continuous
This Data Sheet may be revised by subsequent versions 10 ©2004 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
Rev. B, Issue Date: 2008/06/23