HB52RF649E1U-75B Datasheet, PDF (7/20 Pages) Elpida Memory – 512 MB Registered SDRAM DIMM 64-Mword × 72-bit, 133 MHz Memory Bus, 1-Bank Module (18 pcs of 64 M × 4 Components) PC133 SDRAM

HB52RF649E1U-75B
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
77
Manufacturer’s part number
0 1 0 1 0 0 1 0 52
R
78
Manufacturer’s part number
0 1 0 0 0 1 1 0 46
F
79
Manufacturer’s part number
0 0 1 1 0 1 1 0 36
6
80
Manufacturer’s part
0 0 1 1 0 1 0 0 34
4
81
Manufacturer’s part number
0 0 1 1 1 0 0 1 39
9
82
Manufacturer’s part number
0 1 0 0 0 1 0 1 45
E
83
Manufacturer’s part number
0 0 1 1 0 0 0 1 31
1
84
Manufacturer’s part number
0 1 0 1 0 1 0 1 55
U
85
Manufacturer’s part number
0 0 1 0 1 1 0 1 2D
—
86
Manufacturer’s part number
0 0 1 1 0 1 1 1 37
7
87
Manufacturer’s part number
0 0 1 1 0 1 0 1 35
5
88
Manufacturer’s part number
0 1 0 0 0 0 1 0 42
B
89
Manufacturer’s part number
0 0 1 0 0 0 0 0 20
(Space)
90
Manufacturer’s part number
0 0 1 0 0 0 0 0 20
(Space)
91
Revision code
0 0 1 1 0 0 0 0 30
Initial
92
Revision code
0 0 1 0 0 0 0 0 20
(Space)
93
Manufacturing date
× × × × × × × × ××
Year code
(BCD)
94
Manufacturing date
× × × × × × × × ××
Week code
(BCD)
95 to 98 Assembly serial number
*³
99 to 125 Manufacturer specific data
—————————
*⁴
126
Reserved (Intel specification 0 1 1 0 0 1 0 0 64
frequency)
127
Reserved (Intel specification 1 0 0 0 0 1 1 1 87
CE# latency support)
Notes: 1. All serial PD data are not protected. 0: Serial data, “driven Low”, 1: Serial data, “driven High”.
2. Byte72 is manufacturing location code. (ex: In case of Japan, byte72 is 4AH. 4AH shows “J” on
ASCII code.)
3. Bytes 95 through 98 are assembly serial number.
4. All bits of 99 through 125 are not defined (“1” or “0”).
5. These specifications are defined based on component specification, not module.
Preliminary Data Sheet E0023H10
7