DA14580 Datasheet, PDF (144/155 Pages) –

DA14580
Low Power Bluetooth Smart 4.2 SoC
Table 260: Timing characteristics
Parameter
t_STA(BUCK)
Description
startup time
Conditions
Buck-mode; time from
deep-sleep to software
start.
Typical application, run-
ning from retention RAM
on 16 MHz RC oscillator
Note 9: Worst-case value under Normal Operating Conditions.
Min
Typ
1
(Note 9)
Table 261: 16 MHz Crystal Oscillator: Recommended operating conditions
Parameter
Description
Conditions
Min
Typ
f_XTAL(16M)
crystal oscillator fre-
16
quency
ESR(16M)
equivalent series resist-
ance
C_L(16M)
load capacitance
No external capacitors
10
are required
C₀(16M)
shunt capacitance
f_XTAL(16M)
crystal frequency toler- After optional trimming;
-20
ance
including aging and tem-
perature drift
(Note 10)
f_X-
crystal frequency toler- Untrimmed; including
-40
TAL^{(16M)UNT ance}
aging and temperature
drift
(Note 11)
P_DRV(MAX)(16M maximum drive power (Note 12)
100
)
V_CLK(EXT)(16M) external clock voltage
Only in case of an exter-
1
1.2
nal reference clock on
XTAL16Mp (XTAL16Mm
floating or connected to
mid-level 0.6 V)
_N(EXTER-
NAL)16M
phase noise
f_C = 50 kHz
in case of an external
reference clock
Note 10: Using the internal varicaps a wide range of crystals can be trimmed to the required tolerance.
Note 11: Maximum allowed frequency tolerance for compensation by the internal varicap trimming mechanism.
Note 12: Select a crystal which can handle a drive-level equal or more than this specification
Table 262: 16 MHz Crystal Oscillator: Timing characteristics
Parameter
t_STA(XTAL)(16M)
Description
crystal oscillator startup
time
Conditions
Min
Typ
0.5
2
FINAL
Max
Unit
ms
Max
Unit
MHz
100

12
pF
5
pF
20
ppm
40
ppm
W
V
-130
dBc/
Hz
Max
Unit
3
ms
Datasheet
CFR0011-120-00-FM
Revision 3.3
144 of 155
08-Jun-2016
© 2014 Dialog Semiconductor