PSOC4000 Datasheet, PDF (25/34 Pages) Cypress Semiconductor – Programmable System-on-Chip

PSoC^® 4: PSoC 4000 Family
Datasheet
Packaging
Table 27. Package List
Spec ID#
BID#47A
BID#26
BID#33
BID#40
BID#47
BID#147A
Package
28-Pin SSOP
24-Pin QFN
16-Pin QFN
16-Pin SOIC
8-Pin SOIC
16-Ball WLCSP
Description
28-pin 5 × 10 × 1.65mm SSOP with 0.65-mm pitch
24-pin 4 × 4 × 0.6 mm QFN with 0.5-mm pitch
16-pin 3 × 3 × 0.6 mm QFN with 0.5-mm pitch
16-pin (150 Mil) SOIC
8-pin (150 Mil) SOIC
16-Ball 1.45 × 1.56 × 0.4 mm
Table 28. Package Characteristics
Parameter
Description
T_A
Operating ambient temperature
T_J
Operating junction temperature
T_JA
Package θ_JA (28-pin SSOP)
T_JC
Package θ_JC (28-pin SSOP)
T_JA
Package θ_JA (24-pin QFN)
T_JC
Package θ_JC (24-pin QFN)
T_JA
Package θ_JA (16-pin QFN)
T_JC
Package θ_JC (16-pin QFN)
T_JA
Package θ_JA (16-pin SOIC)
T_JC
Package θ_JC (16-pin SOIC)
T_JA
Package θ_JA (16-ball WLCSP)
T_JC
Package θ_JC (16-ball WLCSP)
T_JA
Package θ_JA (8-pin SOIC)
T_JC
Package θ_JC (8-pin SOIC)
Conditions
Min
Typ
Max
–40
25
85
–40
–
100
–
66.6
–
–
34
–
–
38
–
–
5.6
–
–
49.6
–
–
5.9
–
–
142
–
–
49.8
–
–
90
–
–
0.9
–
–
198
–
–
56.9
–
Table 29. Solder Reflow Peak Temperature
Package
All
Maximum Peak
Temperature
260 °C
Maximum Time at Peak Temperature
30 seconds
Table 30. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-020
Package
All
MSL
MSL 3
Units
°C
°C
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Document Number: 001-89638 Rev. *E
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