PALC22V10D_07 Datasheet, PDF (10/12 Pages) Cypress Semiconductor – Flash Erasable, Reprogrammable CMOS PAL® Device

Ordering Information
I_CC t_PD
t_S
t_CO
(mA) (ns) (ns) (ns)
Ordering Code
130 7.5 5
5 PALC22V10D-7JC
PALC22V10D-7PC
90 10 6
7 PALC22V10D-10JC
PALC22V10D-10PC
150 10 6
7 PALC22V10D-10JI
PALC22V10D-10PI
150 10 6
7 PALC22V10D-10DMB
PALC22V10D-10KMB
PALC22V10D-10LMB
90 15 7.5 10 PALC22V10D-15JC
PALC22V10D-15PC
120 15 7.5 10 PALC22V10D-15JI
PALC22V10D-15PI
120 15 7.5 10 PALC22V10D-15DMB
PALC22V10D-15KMB
PALC22V10D-15LMB
90 25 15 15 PALC22V10D-25JC
PALC22V10D-25PC
120 25 15 15 PALC22V10D-25JI
PALC22V10D-25PI
120 25 15 15 PALC22V10D-25DMB
PALC22V10D-25KMB
PALC22V10D-25LMB
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
Parameter
V_OH
V_OL
V_IH
V_IL
I_IX
I_OZ
I_CC
Subgroups
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
PALC22V10D
Package
Name
J64
P13
J64
P13
J64
P13
D14
K73
L64
J64
P13
J64
P13
D14
K73
L64
J64
P13
J64
P13
D14
K73
L64
Package Type
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
Operating
Range
Commercial
Commercial
Industrial
Military
Commercial
Industrial
Military
Commercial
Industrial
Military
Switching Characteristics
Parameter
Subgroups
t_PD
9, 10, 11
t_CO
9, 10, 11
t_S
9, 10, 11
t_H
9, 10, 11
Document #: 38-00185-H
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