CPC7595 Datasheet, PDF (22/25 Pages) Clare, Inc. – Line Card Access Switch

CPC7595
3.1.2 CPC7595B - 28 Pin SOIC Package
17.983 MIN - 18.085 MAX
(0.708 MIN - 0.712 MAX)
PIN 28
10.109 MIN - 10.516 MAX
(0.398 MIN - 0.414 MAX)
7.391 MIN - 7.595 MAX
(0.291 MIN - 0.299 MAX)
PIN 1
1.270 TYP
(0.050 TYP)
2.438 MIN - 2.642 MAX
(0.096 MIN - 0.104 MAX)
2.235 MIN - 2.438 MAX
(0.088 MIN - 0.096 MAX)
0.254 MIN - 0.737 MAX X45º
(0.010 MIN - 0.029 MAX X45º)
0.366 MIN - 0.467 MAX
(0.014 MIN - 0.018 MAX)
3.1.3 CPC7595M - 28 Pin DFN Package
11.0
0.660 ± 0.102
(0.026 ± 0.004)
0.18
0.2311 MIN - 0.3175 MAX
(0.0091 MIN - 0.0125 MAX)
y _{0.508 MIN - 1.016 MAX}
inar^{(0.020 MIN - 0.040 MAX)}
DIMENSIONS
MM
(INCHES)
Pin 1
0.90 ± 0.10
(0.0355 ±0.0039)
(0.4334)
TOP VIEW
(0.0071)
lim ^7.0
(0.2758)
0.18
(0.0071)
0.75
(0.0295)
e_0.37
(0.0146)
5.0±0.05
(0.1970±0.0020)
0.61
(0.0240)
r _{0.55 ± 0.10}
P^0.20
(0.0217 ± 0.0040)
0.33 +0.07/-0.05
(0.0130 +0.0028/-0.0020)
0.60
(0.0236)
7.5 ± 0.05
(0.2955 ± 0.0020)
0.70
(0.0276)
Bottom side
metallic pad
(0.0079)
Seating Plane
BOTTOM VIEW
0.02 +0.03/-0.02
SIDE VIEW
(0.0008 +0.0012/-0.0008)
Dimensions in mm (inches)
Dimensions and tolerances conform to ANSI Y14.5M-1994
NOTE: For optimum solder joint size, DFN package
printed circuit board lands should extend no more than
0.05 mm past the chip post on the short sides, and no
more than 0.025 mm past the chip posts on the long
sides.
As the metallic pad on the bottom of the DFN package
is connected to the substrate of the die, Clare
recommends that no printed circuit board traces cross
this area to avoid potential shorting issues.
22
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R00B