HCPL-7710-000E Datasheet, PDF (5/18 Pages) AVAGO TECHNOLOGIES LIMITED – 40 ns Propagation Delay, CMOS Optocoupler

Recommended Pb-Free IR Profile
t_p
T_p
260 +0/-5 °C
T_L ^{217 °C}
RAMP-UP
3 °C/SEC. MAX.
T_smax ^{150 - 200 °C}
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition
program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)

Insulation and Safety Related Specifications
  
Value
Parameter
Symbol 7710 0710 Units
Minimum External Air
L(I01) 7.1
4.9 mm
Gap (Clearance)
Minimum External
L(I02) 7.4
4.8 mm
Tracking (Creepage)
Minimum Internal Plastic
0.08 0.08 mm
Gap (Internal Clearance)

Tracking Resistance
CTI
(Comparative Tracking Index)
≥175 ≥175 Volts
Isolation Group
IIIa
IIIa
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimen­sions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed circuit
board, minimum creepage and clearance require­ments
must be met as specified for individual equipment stan-
dards. For creepage, the shortest distance path along the
surface of a printed circuit board between the solder fillets
of the input and output leads must be considered. There
are recommended techniques such as grooves and ribs
which may be used on a printed circuit board to achieve
desired creepage and clearances. Creepage and clearance
distances will also change depending on factors such as
pollution degree and insulation level.