HCPL-7710-000E Datasheet, PDF (4/18 Pages) AVAGO TECHNOLOGIES LIMITED – 40 ns Propagation Delay, CMOS Optocoupler

Package Outline Drawing
HCPL-0710 Outline Drawing (Small Outline SO-8 Package)
LAND PATTERN RECOMMENDATION
8
3.937 ± 0.127
(0.155 ± 0.005)
PIN ONE ¹
0.406 ± 0.076
(0.016 ± 0.003)
765
XXXV
YWW
234
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
1.270 _BSC
(0.050)
7.49 (0.295)
1.9 (0.075)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
45°
X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
* ^{TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)}
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
0.305 _MIN.
(0.012)
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/- 0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
00
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
Note: Non-halide flux should be used.
TIME (SECONDS)