HCPL-2533 Datasheet, PDF (3/11 Pages) AVAGO TECHNOLOGIES LIMITED – LSTTL compatible

Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. _PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/- 0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
50 SEC.
ROOM
TEMPERATURE
00
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t_p
T_p
T_L ^{217 °C}
260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
T_smax ^{150 - 200 °C}
T_smin
t_s
PREHEAT
t_L
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T_smax = 200 °C, T_smin = 150 °C
Note: Non-halide flux should be used.
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
IEC/EN/DIN EN 60747-5-2
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)