SAM4N_14 Datasheet, PDF (785/795 Pages) ATMEL Corporation – ARM-based Flash MCU

38.1 Soldering Profile
Table 38-28 gives the recommended soldering profile from J-STD-020C.
Table 38-28. Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3°C/sec. max.
Preheat Temperature 175°C ± 25°C
180 sec. max.
Temperature Maintained above 217°C
60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260°C
Ramp-down Rate
6°C/sec. max.
Time 25°C to Peak Temperature
8 min. max.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
38.2
Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
z IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern Standards)
http://landpatterns.ipc.org/default.asp
z Atmel Green and RoHS Policy and Package Material Declaration Data Sheet http://www.atmel.com/green/
SAM4N Series [DATASHEET]
11158A–ATARM–07-Jun-13
785