T5557 Datasheet, PDF (23/30 Pages) ATMEL Corporation – Multifunctional 330-bit Read/Write RF-Identification IC

Figure 27. 4 Pad Flip-chip Version with 70 µm Solder Bumps
Dimensions in µm
124
994
97 60
T5557
157
4517E–RFID–02/03
107 100
C2
497
Figure 28. Solder bump on NiAu
70µm
AL bondpad
97
PbSn
Ni
Passivation
23