T5557 Datasheet, PDF (19/30 Pages) ATMEL Corporation – Multifunctional 330-bit Read/Write RF-Identification IC

T5557
Absolute Maximum Ratings
Parameters
Symbol
Value
Unit
Maximum DC current into Coil 1/Coil 2
Maximum AC current into Coil 1/Coil 2
f = 125 kHz
I_coil
20
mA
I_{coil p}
20
mA
Power dissipation (dice)
(free-air condition, time of application: 1 s)
P_tot
100
mW
Electrostatic discharge maximum to
MIL-Standard 883 C method 3015
V_max
4000
V
Operating ambient temperature range
T_amb
-40 to +85
°C
Storage temperature range (data retention reduced)
T_stg
-40 to +150
°C
Electrical Characteristics
T_amb = +25°C; f_coil = 125 kHz; unless otherwise specified
No. Parameters
Test Conditions
Symbol
Min.
Typ.
Max.
Unit Type*
1 RF frequency range
f_RF
2.1
Supply current
T_amb = 25°C ⁽¹⁾
(see Figure 24)
2.2 ^{(without current}
consumed by the
Read – full temperature
range
I_DD
external LC tank circuit)
2.3
Programming full
temperature range
100
125
150
kHz
1.5
3
mA
T
2
4
mA
Q
25
40
mA
Q
3.1
POR threshold
(50 mV hysteresis)
3.2
3.6
4.0
V
Q
3.2 ^{Coil voltage (AC supply)}
3.3
4 Start-up time
5 Clamp voltage
Read mode and write
command ⁽²⁾
Program EEPROM ⁽²⁾
V_{coil pp} = 6 V
10 mA current into
Coil 1/2
V_{coil pp}
t_startup
V_clamp
6
V_clamp
V
Q
8
V_clamp
V
Q
2.5
3
ms
Q
17
23
V
T
6.1
6.2 Modulation parameters
V_coilpp = 6 V on test circuit
generator and
modulation ON ⁽³⁾
V _{mod pp}
I _{mod pp}
4.2
4.8
V
T
400
600
mA
T
6.3
Thermal stability
V_mod/T_amb
-6
mV/°C
Q
*) Type means: T: directly or indirectly tested during production; Q: guaranteed based on initial product qualification data
Notes:
1. I_DD measurement setup R = 100 k; V_CLK = V_coil = 5 V: EEPROM programmed to 00 ... 000 (erase all); chip in modulation
defeat. I_DD = (V_OUTmax - V_CLK)/R
2. Current into Coil 1/Coil 2 is limited to 10 mA. The damping circuitry has the same structure as the e5550. The damping
characteristics are defined by the internally limited supply voltage (= minimum AC coil voltage)
3. V_mod measurement setup: R = 2.3 k; V_CLK = 3 V; setup with modulation enabled (see Figure 25).
4. Since EEPROM performance is influenced by assembly processes, Atmel confirms the parameters for DOW (tested dice
on uncutted wafer) delivery.
5. The tolerance of the on-chip resonance capacitor C_r is ±10% at 3s over whole production. The capacitor tolerance is
±3% at 3s on a wafer basis.
6. The tolerance of the microcodule resonance capacitor C_r is ±5% at 3s over whole production.
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4517E–RFID–02/03