T5557 Datasheet, PDF (21/30 Pages) ATMEL Corporation – Multifunctional 330-bit Read/Write RF-Identification IC

T5557
Ordering Information ⁽²⁾
T5557 a b M c c - xxx
Package
- DDW - Dice on wafer, 6" un-sawn wafer, thickness 300 µm
- DDT - Dice in Tray (waffle pack), thickness 300 µm
- DBW - Dice on solder bumped wafer, thickness 390 µm
Sn63Pb37 on 5 µm Ni/Au, height 70 µm
- TAS - SO8 Package
- PAE - MOA2 Micro-Module
- PP
- Plastic Transponder
Customer ID ⁽¹⁾
- Atmel standard (corresponds to “00")
M01
- Customer ’X’ unique ID code ⁽¹⁾
11
- 2 Pads without on-chip C
14
- 4 Pads with on-chip 75 pF
15
- Micro - Module with 330 pF
01
- 2 Pads without C; Damping during initialisation
Drawing
see Figure 27
see Figure 28
see Figure 31
see Figure 29
see Figure 33
see Figure 26
see Figure 27
see Figure 29
see Figure 26
Notes: 1. Unique customer ID code programming according to Figure 5 is linked to a minimum order quantity of 1 Mio parts per year.
2. For available order codes refer to Atmel Sales/Marketing.
Ordering Examples
(Recommended)
T555711-DDW
Tested dice on unsawn 6” wafer, thickness 300 mm, no on-chip
capacitor, no damping during POR initialisation;
especially for ISO 11784/785 and access control applications
Available Order Codes
T555711-DDW, DDT, TAS, PP
T555714-DDW, DBW, TAS
T555715-PAE
21
4517E–RFID–02/03