PALCE26V12 Datasheet, PDF (20/21 Pages) Advanced Micro Devices – 28-Pin EE CMOS Versatile PAL Device

AMD
TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
PALCE26V12
Parameter
Symbol Parameter Description
Typ
SKINNYDIP PLCC
Unit
θjc
Thermal impedance, junction to case
19
18
°C/W
θja
Thermal impedance, junction to ambient
65
55
°C/W
θjma
Thermal impedance, junction to ambient with air flow 200 lfpm air
59
400 lfpm air
54
600 lfpm air
50
800 lfpm air
50
48
°C/W
44
°C/W
39
°C/W
37
°C/W
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of
the package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at
a constant temperature. Therefore, the measurements can only be used in a similar environment.
PALCE26V12H-15/20
2–325