MT47H128M16PK-25E Datasheet, PDF (24/133 Pages) Alliance Semiconductor Corporation – 2Gb: x4, x8, x16 DDR2 SDRAM

2Gb: x4, x8, x16 DDR2 SDRAM
Electrical Specifications – Absolute Ratings
Table 6: Temperature Limits
Parameter
Symbol
Min
Max
Units
Notes
Storage temperature
Operating temperature – commercial
Operating temperature – industrial
T_STG
–55
150
T_C
0
85
T_C
–40
95
T_AMB
–40
85
°C
1
°C
2, 3
°C
2, 3, 4
°C
4, 5
Notes:
1. MAX storage case temperature T_STG is measured in the center of the package, as shown
in Figure 12. This case temperature limit is allowed to be exceeded briefly during pack-
age reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Pa-
rameters.”
2. MAX operating case temperature T_C is measured in the center of the package, as shown
in Figure 12.
3. Device functionality is not guaranteed if the device exceeds maximum T_C during opera-
tion.
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
Figure 12: Example Temperature Test Point Location
Test point
Length (L)
0.5 (L)
0.5 (W)
Width (W)
Lmm x Wmm FBGA
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN
24
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