MT47H128M16PK-25E Datasheet, PDF (18/133 Pages) Alliance Semiconductor Corporation – 2Gb: x4, x8, x16 DDR2 SDRAM

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
2Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Seating
plane
0.12 A ^A
84X Ø0.45
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
987
11.2 CTR
0.8 TYP
0.8 ±0.1
321
Ball A1 ID
A
B
C
D
E
F
G
H 14 ±0.15
J
K
L
M
N
P
R
Ball A1 ID
0.8 TYP
6.4 CTR
11.5 ±0.15
1.2 MAX
0.25 MIN
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
PDF: 09005aef824f87b6
2Gb_DDR2.pdf – Rev. H 10/11 EN
18
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.