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MT47H128M16PK-25E Datasheet, PDF (1/133 Pages) Alliance Semiconductor Corporation – 2Gb: x4, x8, x16 DDR2 SDRAM | |||
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2Gb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H512M4 â 64 Meg x 4 x 8 banks
MT47H256M8 â 32 Meg x 8 x 8 banks
MT47H128M16 â 16 Meg x 16 x 8 banks
Features
⢠VDD = 1.8V ±0.1V, VDDQ = 1.8V ±0.1V
⢠JEDEC-standard 1.8V I/O (SSTL_18-compatible)
⢠Differential data strobe (DQS, DQS#) option
⢠4n-bit prefetch architecture
⢠Duplicate output strobe (RDQS) option for x8
⢠DLL to align DQ and DQS transitions with CK
⢠8 internal banks for concurrent operation
⢠Programmable CAS latency (CL)
⢠Posted CAS additive latency (AL)
⢠WRITE latency = READ latency - 1 tCK
⢠Programmable burst lengths: 4 or 8
⢠Adjustable data-output drive strength
⢠64ms, 8192-cycle refresh
⢠On-die termination (ODT)
⢠Industrial temperature (IT) option
⢠RoHS-compliant
⢠Supports JEDEC clock jitter specification
Options1
⢠Configuration
â 512 Meg x 4 (64 Meg x 4 x 8 banks)
â 256 Meg x 8 (32 Meg x 8 x 8 banks)
â 128 Meg x 16 (16 Meg x 16 x 8 banks)
⢠FBGA package (Pb-free) â x16
â 84-ball FBGA (11.5mm x 14mm) Rev. A
⢠FBGA package (Pb-free) â x4, x8
â 60-ball FBGA (11.5mm x 14mm) Rev. A
⢠FBGA package (Pb-free) â x16
â 84-ball FBGA (9mm x 12.5mm) Rev. C
⢠FBGA package (Pb-free) â x4, x8
â 60-ball FBGA (9mm x 11.5mm) Rev. C
⢠FBGA package (Lead solder) â x16
â 84-ball FBGA (9mm x 12.5mm) Rev. C
⢠Timing â cycle time
â 1.875ns @ CL = 7 (DDR2-1066)
â 2.5ns @ CL = 5 (DDR2-800)
â 2.5ns @ CL = 6 (DDR2-800)
â 3.0ns @ CL = 5 (DDR2-667)
⢠Self refresh
â Standard
⢠Operating temperature
â Commercial (0°C ⤠TC ⤠+85°C)
â Industrial (â40°C ⤠TC ⤠+95°C;
â40°C ⤠TA ⤠+85°C)
⢠Revision
Marking
512M4
256M8
128M16
HG
HG
RT
EB
PK
-187E
-25E
-25
-3
None
None
IT
:A/:C
Note:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
PDF: 09005aef824f87b6
2Gb_DDR2.pdf â Rev. H 10/11 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2006 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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