ADP5586 Datasheet, PDF (5/44 Pages) Analog Devices – Keypad Decoder and I/O Port Expander

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VDD to GND
SCL, SDA, RST, INT, R0, R1, R2, R3, R4,
C0, C1, C2, C3, C4
Temperature Range
Operating (Ambient)
Operating (Junction)
Storage
Rating
−0.3 V to +4 V
−0.3 V to (VDD + 0.3 V)
−40°C to +85°C¹
−40°C to +125°C
−65°C to +150°C
1 _{In applications where high power dissipation and poor thermal resistance}
are present, the maximum ambient temperature may need to be derated.
Maximum ambient temperature (TA (MAX)) is dependent on the maximum
operating junction temperature (TJ (MAXOP) = 125°C), the maximum power
dissipation of the device (PD (MAX)), and the junction-to-ambient thermal
resistance of the device/package in the application (θJA), using the following
equation: TA (MAX) = TJ (MAXOP) − (θJA × PD (MAX)).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in com-
bination. Unless otherwise specified, all other voltages are
referenced to GND.
ADP5586
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a printed circuit board (PCB) for surface-mount
packages.
Table 4.
Thermal Resistance
16-Ball WLCSP
Maximum Power Dissipation
θJA
Unit
62
°C/W
70
mW
ESD CAUTION
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