A3P1000-1FGG144I Datasheet, PDF (19/206 Pages) Actel Corporation – ProASIC3 Flash Family FPGAs

ProASIC3 DC and Switching Characteristics
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
T_J = Junction Temperature = ∆T + T_A
EQ 2-1
where:
T_A = Ambient Temperature
∆T = Temperature gradient between junction (silicon) and ambient ∆T = θ_ja * P
θ_ja = Junction-to-ambient of the package. θ_ja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ_jc and the junction-to-ambient air thermal
resistivity is θ_ja. The thermal characteristics for θ_ja are shown for two air flow rates. The absolute
maximum junction temperature is 100°C. EQ 2-2 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
Maximum Power Allowed = ^{M------a---x---.---j-u---n----c---t--i-o---n-----t--e---m-----p----.-----(--°}---C----)---^–-----M-----a---x---.---a---m-----b----i-e---n---t----t--e---m-----p---.----(--^°---C----) = ^{1----0---0----°}----C-----^–-----7---0----^°---C--- = 1.463 W^·
θ_ja(° C/W)
20.5° C/W
EQ 2-2
Table 2-5 • Package Thermal Resistivities
Package Type
Quad Flat No Lead
Device
A3P030
θ_ja
Pin Count θ_jc Still Air 200 ft./min. 500 ft./min. Units
132
0.4 21.4
16.8
15.3
C/W
A3P060
132
0.3 21.2
16.6
15.0
C/W
A3P125
132
0.2 21.1
16.5
14.9
C/W
A3P250
132
0.1 21.0
16.4
14.8
C/W
Very Thin Quad Flat Pack (VQFP)
All devices 100 10.0 35.3
29.4
27.1
C/W
Thin Quad Flat Pack (TQFP)
All devices 144 11.0 33.5
28.0
25.7
C/W
Plastic Quad Flat Pack (PQFP)
All devices 208
8.0 26.1
22.5
20.8
C/W
PQFP with embedded heatspreader All devices 208
3.8 16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
See note*
144
3.8 26.9
22.9
21.5
C/W
See note*
256
3.8 26.6
22.8
21.5
C/W
See note*
484
3.2 20.5
17.0
15.9
C/W
A3P1000
144
6.3 31.6
26.2
24.2
C/W
A3P1000
256
6.6 28.1
24.4
22.7
C/W
A3P1000
484
8.0 23.3
19.0
16.7
C/W
* This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
v1.3
2-5