XC3100A Datasheet, PDF (8/8 Pages) Xilinx, Inc – Ultra-high-speed FPGA family with six members

XC3100, XC3100A Logic Cell Array Family
For a detailed description of the device architecture, see pages 2-105 through 2-123.
For a detailed description of the configuration modes and their timing, see pages 2-124 through 2-132.
For detailed lists of package pin-outs, see pages 2-140 through 2-150.
For package physical dimensions and thermal data, see Section 4.
Ordering Information
Example:
Device Type
XC3130A-70PC44C
Temperature Range
Toggle Rate
Number of Pins
Package Type
Component Availability
PINS
TYPE
44
64
68
84
100
132
144 160 164
175
176 208 223
TOP-
TOP-
PLAST. PLAST. PLAST. PLAST. CERAM PLAST. PLAST. PLAST. BRAZED PLAST. CERAM. PLAST. PLAST. BRAZED PLAST. CERAM. PLAST. PLAST. CERAM.
PLCC VQFP PLCC PLCC PGA PQFP TQFP VQFP CQFP PGA PGA TQFP PQFP CQFP PGA PGA TQFP PQFP PGA
CODE
XC3120A
XC3130A
XC3142A
XC3164A
XC3190A
XC3195A
PC44 VQ64 PC68 PC84 PG84 PQ100 TQ100 VQ100 CB100 PP132 PG132 TQ144 PQ160 CB164 PP175 PG175 TQ176 PQ208 PG223
-5
CI
CI
CI
CI
-4
CI
CI
CI
CI
-3
CI
CI
CI
CI
-2
C
C
C
C
-1
C
C
C
C
-5 C I
CI
CI
CI
CI
C
-4 C I
CI
CI
CI
CI
C
-3 C I
CI
CI
CI
CI
C
-2 C
C
C
C
C
C
-1 C
C
C
C
C
C
-5
CI CIMB CI
C
MB
C CIMB CI
-4
CI
CI
CI
C
C
CI
CI
-3
CI
CI
CI
C
C
CI
CI
-2
C
C
C
C
C
C
C
-1
C
C
C
C
C
C
C
-5
CI
CI
CI
CI
CI
-4
CI
CI
CI
CI
CI
-3
CI
CI
CI
CI
CI
-2
C
C
C
C
C
-1
C
C
C
C
C
-5
CI
CI
MB
CI CIMB CI
CI
-4
CI
CI
CI
CI
CI
CI
-3
CI
CI
CI
CI
CI
CI
-2
C
C
C
C
C
C
-1
C
C
C
C
C
C
-5
CI
CI
MB
CI CIMB
CI CIMB
-4
CI
CI
CI
CI
CI
CI
-3
CI
CI
CI
CI
CI
CI
-2
C
C
C
C
C
C
-1
C
C
C
C
C
C
C = Commercial = 0° to +85° C I = Industrial = -40° to +100° C M = Mil Temp = -55° to +125° C B = MIL-STD-883C Class B
Parentheses indicate future product plans
2-184