XC3100A Datasheet, PDF (2/8 Pages) Xilinx, Inc – Ultra-high-speed FPGA family with six members

XC3100, XC3100A Logic Cell Array Family
Xilinx maintains test specifications for each product as controlled documents. To insure the use of the most recently
released device performance parameters, please request a copy of the current test-specification revision.
Absolute Maximum Ratings
Symbol Description
V_CC Supply voltage relative to GND
V_IN Input voltage with respect to GND
V_TS Voltage applied to 3-state output
T_STG Storage temperature (ambient)
T_SOL Maximum soldering temperature (10 s @ 1/16 in.)
Junction temperature plastic
T_J
Junction temperature ceramic
–0.5 to +7.0
–0.5 to V_CC +0.5
–0.5 to V_CC +0.5
–65 to +150
+260
+125
+150
Units
V
V
V
°C
°C
°C
°C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed
under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for
extended periods of time may affect device reliability.
Operating Conditions
Symbol Description
Min Max Units
V_CC
Supply voltage relative to GND Commercial 0°C to +85°C junction
4.75 5.25 V
Supply voltage relative to GND Industrial -40°C to +100°C junction
4.5 5.5
V
V_IHT
High-level input voltage — TTL configuration
2.0
V_CC
V
V_ILT
Low-level input voltage — TTL configuration
0
0.8
V
V_IHC
High-level input voltage — CMOS configuration
70% 100% V_CC
V_ILC
Low-level input voltage — CMOS configuration
0
20% V_CC
T_IN
Input signal transition time
250 ns
At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.3% per °C.
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