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XC3000L Datasheet, PDF (2/8 Pages) Xilinx, Inc – Part of the ZERO+ family of 3.3 V FPGAs
XC3000L Logic Cell Array Family
Xilinx maintains test specifications for each product as controlled documents. To insure the use of the most recently
released device performance parameters, please request a copy of the current test-specification revision.
Absolute Maximum Ratings
Symbol Description
VCC Supply voltage relative to GND
VIN Input voltage with respect to GND
VTS Voltage applied to 3-state output
TSTG Storage temperature (ambient)
TSOL Maximum soldering temperature (10 s @ 1/16 in.)
Junction temperature plastic
TJ
Junction temperature ceramic
–0.5 to +7.0
–0.5 to VCC +0.5
–0.5 to VCC +0.5
–65 to +150
+260
+125
+150
Units
V
V
V
°C
°C
°C
°C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum
Ratings conditions for extended periods of time may affect device reliability.
Operating Conditions
Symbol Description
Min Max Units
VCC
Supply voltage relative to GND Commercial 0°C to +85°C junction
3.0
3.6 V
VIH
High-level input voltage
2.0 VCC +0.3 V
VIL
Low-level input voltage
-0.3
0.8 V
TIN
Input signal transition time
250 ns
At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.3% per °C.
Although the present (1994) devices operate over the full supply voltage range from 3.0 to 5.25 V, Xilinx reserves the
right to restrict operation to the 3.0 to 3.6 V range later, when smaller device geometries might preclude operation at 5 V.
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