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XQ4000E Datasheet, PDF (19/36 Pages) Xilinx, Inc – System Performance beyond 60 MHz
R
QPRO XQ4000E/EX QML High-Reliability FPGAs
XQ4028EX Recommended Operating Conditions(1)
Symbol
Descriptiont
Min
Max
VCC Supply voltage relative to GND, TJ = –55°C to +125°C Plastic
Supply voltage relative to GND, TC = –55°C to +125°C Ceramic
VIH High-level input voltage(2)
TTL inputs
CMOS inputs
4.5
4.5
2.0
70%
5.5
5.5
VCC
100%
VIL Low-level input voltage
TTL inputs
0
CMOS inputs
0
0.8
20%
TIN Input signal transition time
-
250
Notes:
1. At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.35% per °C.
2. Input and output measurement threshold are 1.5V for TTL and 2.5V for CMOS.
XQ4028EX DC Characteristics Over Recommended Operating Conditions
Symbol
Description
Min
VOH High-level output voltage at IOH = –4 mA, VCC min
High-level output voltage at IOH = –1 mA
VOL Low-level output voltage at IOL = 12 mA, VCC min(1)
TTL outputs
CMOS outputs
TTL outputs
CMOS outputs
2.4
VCC – 0.5
-
-
VDR Data retention supply voltage (below which configuration data may be lost)
3.0
ICCO Quiescent FPGA supply current(2)
-
IL
Input or output leakage current
–10
CIN Input capacitance (sample tested)
Plastic packages
-
Ceramic packages
-
IRPU Pad pull-up (when selected) at VIN = 0V (sample tested)
0.02
IRPD Pad pull-down (when selected) at VIN = 5.5V (sample tested)
0.02
IRLL Horizontal longline pull-up (when selected) at logic Low(3)
0.3
Notes:
1. With up to 64 pins simultaneously sinking 12 mA.
2. With no output current loads, no active input or Longline pull-up resistors, all package pins at VCC or GND.
Max
-
-
0.4
0.4
-
25
10
10
16
0.25
0.25
2.0
Units
V
V
V
VCC
V
VCC
ns
Units
V
V
V
V
V
mA
µA
V
V
mA
mA
mA
DS021 (v2.2) June 25, 2000
www.xilinx.com
19
Product Specification
1-800-255-7778