WM8946 Datasheet, PDF (173/175 Pages) Wolfson Microelectronics plc – Stereo Low-Power CODEC with Video Buffer

Production Data
PACKAGE DIMENSIONS
B: 36 BALL W-CSP PACKAGE 2.970 X 3.070 X 0.7mm BODY, 0.50 mm BALL PITCH
WM8946
DM063.B
2
A
G A2
DETAIL 2
DETAIL 1
6
5
4
3
2
1
A
4
A1
CORNER
B
e5
C
E1
D
E
F
e
ddd M Z A B
D1
BOTTOM VIEW
2X
2X
aaa B
aaa A
6
D
A
E
TOP VIEW
B
f1
bbb Z
f2
h
1
Z
A1
ccc Z
DETAIL 2
Symbols
A
A1
A2
D
D1
E
E1
e
f1
f2
g
h
aaa
bbb
ccc
ddd
MIN
0.660
0.207
0.418
2.945
3.045
0.223
0.273
0.264
Dimensions (mm)
NOM
MAX
0.700
0.740
0.244
0.281
0.434
0.450
2.970
2.995
2.500 BSC
3.070
3.095
2.500 BSC
0.500 BSC
0.022
0.314
0.025
0.060
0.030
0.015
0.364
NOTE
5
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
w
PD, July 2012, Rev 4.3
173