W77LE532_07 Datasheet, PDF (81/88 Pages) Winbond – 8-BIT MICROCONTROLLER

W77LE532/W77L532A
20. PACKAGE DIMENSIONS
20.1 40-pin DIP
40
E1
A A2
L
1
S
D
B
e1
B1
21
20
E
A1
Base Plane
Seating Plane
a
eA
Symbol
Dimension in inches
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.334
A1
0.010
0.254
A2
0.150 0.155 0.160 3.81
3.937 4.064
B
0.016 0.018 0.022 0.406 0.457 0.559
B1
0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E
0.590 0.600 0.610 14.986 15.24 15.494
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold p.arting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
20.2 44-pin PLCC
6
7
HD
D
1 44
40
39
E
HE
17
18
29
28
L
θ
Seating Plane
e
b
b1
GD
A2 _A
A1
y
GE
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
Dimension in inches
Min. Nom. Max.
0.185
0.020
0.145 0.150 0.155
0.026 0.028 0.032
0.016 0.018 0.022
0.008 0.010 0.014
0.648 0.653 0.658
0.648 0.653 0.658
0.050 BSC
0.590 0.610 0.630
0.590 0.610 0.630
0.680 0.690 0.700
0.680 0.690 0.700
0.090 0.100 0.110
0.004
Dimension in mm
Min. Nom. Max.
4.699
0.508
3.683 3.81 3.937
0.66 0.711 0.813
0.406 0.457 0.559
0.203 0.254 0.356
16.46 16.59 16.71
16.46 16.59 16.71
1.27 BSC
14.99 15.49 16.00
14.99 15.49 16.00
17.27 17.53 17.78
17.27 17.53 17.78
2.296 2.54 2.794
0.10
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
- 81 -
Publication Release Date: February 1, 2007
Revision A7