W25Q128BV_13 Datasheet, PDF (8/74 Pages) Winbond – 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q128BV
3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Top View
Top View
A2
A3
A4
A5
NC
NC
NC
NC
B1
B2
B3
B4
B5
NC
CLK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
/CS
NC /WP (IO2) NC
D1
D2
D3
D4
D5
NC
DO(IO1) DI(IO0) _/HOLD(IO3) NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
CLK
GND
VCC
C1
C2
C3
C4
NC
/CS
NC /WP (IO2)
D1
D2
D3
D4
NC DO(IO1) DI(IO0) /HOLD(IO3)
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
Package Code B
Package Code C
Figure 1c. W25Q128BV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code B, C)
3.6 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*²
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)*¹
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)*¹
D4
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*²
Multiple
NC
No Connect
*1: IO0 and IO1 are used for Standard and Dual SPI instructions.
*2: IO0 – IO3 are used for Quad SPI instructions, /WP or /HOLD functions are only available for Standard/Dual SPI.
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