W25Q128BV_13 Datasheet, PDF (6/74 Pages) Winbond – 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q128BV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q128BV is offered in an 8-pad WSON 8x6-mm (package code E), a 16-pin SOIC 300-mil (package
code F) and two 24-ball 8x6-mm TFBGAs (package code B, C) as shown in Figure 1a-c respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
Top View
/CS
18
VCC
DO (IO₁)
/WP (IO₂)
GND
27
36
45
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25Q128BV Pad Assignments, 8-pad WSON 8x6-mm (Package Code E)
3.2 Pad Description WSON 8x6-mm
PAD NO.
1
2
3
4
5
6
7
8
PAD NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)*¹
I/O
Write Protect Input ( Data Input Output 2)*²
Ground
I/O
Data Input (Data Input Output 0)*¹
I
Serial Clock Input
I/O
Hold Input (Data Input Output 3)*²
Power Supply
*1: IO0 and IO1 are used for Standard and Dual SPI instructions
*2: IO0 – IO3 are used for Quad SPI instructions
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