W25Q128BV_13 Datasheet, PDF (4/74 Pages) Winbond – 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q128BV
7.2.39 Read Security Registers (48h) ...........................................................................................59
8. ELECTRICAL CHARACTERISTICS .............................................................................................. 60
8.1 Absolute Maximum Ratings ^{(1)(2)......................................................................................} 60
8.2 Operating Ranges .............................................................................................................. 60
8.3 Power-up Timing and Write Inhibit Threshold(1) ............................................................... 61
8.4 DC Electrical Characteristics.............................................................................................. 62
8.5 AC Measurement Conditions ............................................................................................. 63
8.6 AC Electrical Characteristics .............................................................................................. 64
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 65
8.8 Serial Output Timing........................................................................................................... 66
8.9 Serial Input Timing.............................................................................................................. 66
8.10 HOLD Timing...................................................................................................................... 66
8.11 WP Timing .......................................................................................................................... 66
9. PACKAGE SPECIFICATION.......................................................................................................... 67
9.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 67
9.2 16-Pin SOIC 300-mil (Package Code F) ............................................................................ 68
9.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array)........................................... 69
9.4 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array) .............................................. 70
10. ORDERING INFORMATION .......................................................................................................... 71
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 72
11. REVISION HISTORY...................................................................................................................... 73
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