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| W25Q32BV_13 Datasheet, PDF (77/78 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |||
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W25Q32BV
10.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q32BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
Part Numbers for Industrial Grade Temperature:
PACKAGE TYPE
DENSITY
PRODUCT NUMBER
SS
SOIC-8 208mil
ST(2)
VSOP-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP(1)
WSON-8 6x5mm
ZE(1)(2)
WSON-8 8x6mm
TB(2)
TFBGA-24 8x6mm
5x5 ball array
TC(2)
TFBGA-24 8x6mm
6x4 ball array
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
W25Q32BVSSIG
W25Q32BVSSIP
W25Q32BVSTIG
W25Q32BVSTIP
W25Q32BVSFIG
W25Q32BVSFIP
W25Q32BVDAIG
W25Q32BVDAIP
W25Q32BVZPIG
W25Q32BVZPIP
W25Q32BVZEIG
W25Q32BVZEIP
W25Q32BVTBIG
W25Q32BVTBIP
W25Q32BVTCIG
W25Q32BVTCIP
Notes:
1. For WSON packages, the package type ZP and ZE are not used in the top side marking.
2. These package types are special order, please contact Winbond for ordering information.
TOP SIDE MARKING
25Q32BVSIG
25Q32BVSIP
25Q32BVTIG
25Q32BVTIP
25Q32BVFIG
25Q32BVFIP
25Q32BVAIG
25Q32BVAIP
25Q32BVIG
25Q32BVIP
25Q32BVIG
25Q32BVIP
25Q32BVBIG
25Q32BVBIP
25Q32BVCIG
25Q32BVCIP
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Publication Release Date: October 04,2013
Revision I
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